Hitron’s high-split portfolio supports a software switchable return path up to 204 MHz to enhance upstream capacity in DOCSIS 3.1 networks
With a high-split configuration, Hitron DOCSIS 3.1 gateways, EMTA’s and modems are able to sustain bidirectional traffic of over 2 Gbps downstream and over 1 Gbps upstream. High-split architectures are used to increase upstream bandwidth in today’s DOCSIS 3.1 networks, as well as future DOCSIS 4.0 networks. While many North American networks have an upstream spectrum range of 5 MHz to 42 MHz or 85 MHz, high-split increases the range to 204 MHz. With this increase in usable spectrum, cable operators can deliver Gigabit upstream speeds over their HFC networks.
Hitron products feature a software switchable return path that enables operators to remotely change between 5-85 MHz and 5-204 MHz at any time. As a result, they can seamlessly upgrade customers to more lucrative higher tier upstream speeds without changing hardware or sending out a technician.
“Over the past years, the increased use of video conferencing for working and learning from home has really sparked demand for upstream capacity. We’ve seen strong interest from across the cable industry in high-split architectures as a way to cost-effectively boost upstream bandwidth today without having to make the jump to fiber,” said Greg Fisher, President and Chief Technology Officer at Hitron Americas.
Hitron’s high-split solutions include the following DOCSIS 3.1 gateways, EMTA’s and modems: CODA-5712, CODA-5719, CODA-5810, CODA5814Q, CODA-57, and EN2251-HSP. The company will be showcasing its high-split solutions at SCTE Cable-Tec Expo 2022 (Booth # 4037) in Philadelphia, PA from September 19-22.
About Hitron Technologies Inc.
Hitron is changing the way the world works, plays and connects. With a growing count of eleven first-to-market DOCSIS launches and powering DOCSIS 3.0 24×8, 32×8, and DOCSIS 3.1 deployments, Hitron has shipped over 40 million DOCSIS units to customers worldwide. Our leadership in broadband and Wi-Fi technology, combined with our vertically integrated manufacturing services, enable us to continually push the envelope of what’s possible and deliver custom, cost-effective and scalable solutions.